大芯片粘接首选EV2118-2导电银胶

大芯片粘接首选EV2118-2导电银胶

 

导热性:4W/mK;储能模量:686,000psi;Pot-life:3天

 

导电性:<0.0005 Ohm-cm ;硬度:Shore A  55;Die Shear: 9.3Kg

Shanghai Tongtai Chemical Co.,Ltd

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Charmson Technology Limited TaiWan Branch(SAMOA)

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